Title:
SIZING DEVICE AND METHOD FOR MANUFACTURING SINTERED COMPACT
Document Type and Number:
WIPO Patent Application WO/2019/038816
Kind Code:
A1
Abstract:
A sizing device is provided with: a die set that is provided with a die plate for holding a die provided with a through hole supplied with a workpiece, and an upper and lower punch inserted into the through hole and applying pressure to the workpiece; a press main body that is provided with a punch drive mechanism for operating the punch and to which the die set is detachably attached in a prescribed position; and a turntable that rotates on the die plate so as to supply the workpiece to the die and eliminate the workpiece from the die. The die set is provided with the turntable and a support base whereon the turntable is mounted. The support base is provided coaxially with the center axis of the turntable, and is provided with an axial positioning unit for positioning the center axis in a prescribed position on the support base.
Inventors:
HAYASHI SHINJI (JP)
TAKEUCHI KENJI (JP)
TAKEUCHI KENJI (JP)
Application Number:
PCT/JP2017/029828
Publication Date:
February 28, 2019
Filing Date:
August 21, 2017
Export Citation:
Assignee:
SUMITOMO ELECTRIC SINTERED ALLOY LTD (JP)
International Classes:
B22F3/24; B30B11/02; B30B11/10
Foreign References:
| JPH0570807A | 1993-03-23 | |||
| JP2006263764A | 2006-10-05 | |||
| JP2014156659A | 2014-08-28 | |||
| JP2011080113A | 2011-04-21 |
Attorney, Agent or Firm:
YAMANO, Hiroshi (JP)
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