Title:
SKIVING DEVICE AND SKIVING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/049257
Kind Code:
A1
Abstract:
In the present invention, a rotating mechanism 9 rotates a primary shaft 2a to which a to-be-cut material 6 is attached. A feed mechanism 8 feeds a cutting blade 4a disposed diagonally with respect to the rotational axis line of the to-be-cut material 6 in a direction that includes a cutting direction component which is perpendicular to the rotational axis line, while the cutting blade is sunk into the to-be-cut material 6, thereby machining the surface of the to-be-cut material 6. The cutting blade 4a of a cutting tool 4 is formed by scanning a cylindrical radiation region, including the focal point of a laser beam, onto a diamond coated layer of a tip base material.
Inventors:
SHAMOTO EIJI (JP)
ITOIGAWA FUMIHIRO (JP)
MORI RYUZO (JP)
ITOIGAWA FUMIHIRO (JP)
MORI RYUZO (JP)
Application Number:
PCT/JP2020/031049
Publication Date:
March 18, 2021
Filing Date:
August 18, 2020
Export Citation:
Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
NAGOYA INST TECH (JP)
MURATA MACHINERY LTD (JP)
NAGOYA INST TECH (JP)
MURATA MACHINERY LTD (JP)
International Classes:
B23B1/00; B23B27/14; B23B27/20; B23K26/361; C23C16/27; C23C16/56
Foreign References:
| JP2010256341A | 2010-11-11 | |||
| JP2019042755A | 2019-03-22 | |||
| JP2018135596A | 2018-08-30 |
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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