Title:
SLICE ENCAPSULATING DEVICE AND MANUFACTURING METHOD AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/111427
Kind Code:
A1
Abstract:
The present invention provides a slice encapsulating device of the present invention having a film-shaped base layer made of an organic polymer material and a film-shaped cover layer made of an organic polymer material. One main surface of the base layer has adhesiveness and is an arrangement surface for arranging a slice. One main surface of the cover layer is a cover surface for covering the slice arranged on the arrangement surface of the base layer and sticking to the arrangement surface. At least one of the arrangement surface and the cover surface has an area for enclosing a plurality of slices arranged side by side next to each other, and the other surface has a structure enabling the detachable attachment to the one surface so as to individually hermetically seal the plurality of slices arranged side by side next to each other and release the hermetic seal individually.
Inventors:
FUKUOKA JUNYA (JP)
YOSHIKAWA AKIRA (JP)
YOSHIKAWA AKIRA (JP)
Application Number:
PCT/JP2018/011192
Publication Date:
June 13, 2019
Filing Date:
March 20, 2018
Export Citation:
Assignee:
N LAB CO LTD (JP)
International Classes:
G01N1/28
Foreign References:
| JPH09210877A | 1997-08-15 | |||
| JP2011188835A | 2011-09-29 | |||
| JP2008076136A | 2008-04-03 |
Attorney, Agent or Firm:
TAKASHIMA, Hajime et al. (JP)
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