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Patent Searching and Data


Title:
SLICING DEVICE FOR HARD, BRITTLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/047652
Kind Code:
A1
Abstract:
The purpose is to provide a slicing device for hard, brittle material that can significantly shorten the time required to slice hard, brittle material and that can efficiently slice hard, brittle material. Provided is a slicing device for hard, brittle material that slices hard, brittle material (W) by cutting the hard, brittle material (W) while rotating a rotary grindstone (10) in a process in which a feed mechanism (20) feeds the hard, brittle material (W) in a prescribed direction, wherein after the feed rate of the hard, brittle material (W) by the feed mechanism (20) is gradually decreased in accordance with the contact area (S) between the rotary grindstone (10) and the hard, brittle material (W) being increased, the feed rate of the hard, brittle material (W) by the feed mechanism (20) is gradually increased in accordance with the contact area between the rotary grindstone (10) and the hard, brittle material (W) being decreased.

Inventors:
NISHIMURA Yukiyasu (221, Asagoi-cho, Omihachiman-sh, Shiga 17, 〒5230817, JP)
Application Number:
JP2017/030736
Publication Date:
March 15, 2018
Filing Date:
August 28, 2017
Export Citation:
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Assignee:
SUNKIKO CO., LTD. (221 Asagoi-cho, Omihachiman-shi Shiga, 17, 〒5230817, JP)
International Classes:
B24B27/06; B24B49/10; B24B49/16; B28D1/24; H01F41/02
Foreign References:
JPH07227759A1995-08-29
JPH08229935A1996-09-10
JP2010129854A2010-06-10
JPH06169013A1994-06-14
JP2000218505A2000-08-08
JPS5580127U1980-06-02
JPS6374562A1988-04-05
Attorney, Agent or Firm:
KOBAYASHI Masaki (IPM International Patent&Trademark Office, OsakaekimaeNo.4-15F11-4,Umeda1-chome,Kita-ku,Osaka-sh, Osaka 01, 〒5300001, JP)
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