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Title:
SLICING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/097989
Kind Code:
A1
Abstract:
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is made to move, thereby obtaining multiple sliced wafers. The copper concentration in the coolant supplied to the wire is less than or equal to 80ppm. Thus, a slicing method is provided which involves using a wire saw to stably obtain high-purity silicon wafers with reduced copper contamination.

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Inventors:
KITAGAWA KOJI (JP)
Application Number:
PCT/JP2014/005983
Publication Date:
July 02, 2015
Filing Date:
December 01, 2014
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; B24B27/06; B24B57/02; B28D5/04
Domestic Patent References:
WO2011105255A12011-09-01
Foreign References:
JP2009220269A2009-10-01
JP2011005561A2011-01-13
JP2010040935A2010-02-18
JP2003225700A2003-08-12
JP2011016185A2011-01-27
JP2012015181A2012-01-19
JP2012024866A2012-02-09
JP2013146802A2013-08-01
JP2012514349A2012-06-21
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
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