Title:
SLIDING MEMBER
Document Type and Number:
WIPO Patent Application WO/2013/140883
Kind Code:
A1
Abstract:
There is provided a sliding member formed by combining a resin overlay and a soft metal overlay. The sliding member has a soft layer (3) comprising a metallic material with a hardness of less than 40 HV provided under a resin overlay layer (4) comprising a solid lubricant and resin. In the event of contamination by foreign matter, the soft layer (3) under the resin overlay layer (4) is capable of plastic deformation and the resin overlay layer (4) is capable of partial deformation accompanying the plastic deformation due to the hardness (T1) (μm) of the soft layer (3) and the hardness (T2) (μm) of the resin overlay layer (4) being such that 0.2≤T1/T2≤7.0 and 3.0≤T1≤20.0. Consequently, foreign matter is desirably embedded and resistance to foreign matter can be improved. Low friction is maintained by the resin overlay layer (4) even after contamination by foreign matter.
Inventors:
ASAKURA HIROYUKI (JP)
YASUI MIKIHITO (JP)
HANEDA SHIGEYA (JP)
YASUI MIKIHITO (JP)
HANEDA SHIGEYA (JP)
Application Number:
PCT/JP2013/052871
Publication Date:
September 26, 2013
Filing Date:
February 07, 2013
Export Citation:
Assignee:
DAIDO METAL CO (JP)
International Classes:
F16C33/12; B32B15/08; C22C11/00; C22C11/06; C22C12/00
Domestic Patent References:
| WO2002075172A1 | 2002-09-26 |
Foreign References:
| JPH11325077A | 1999-11-26 | |||
| JP2008014454A | 2008-01-24 | |||
| JP2006283905A | 2006-10-19 | |||
| JP2004211859A | 2004-07-29 |
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, p. c. (JP)
Patent business corporation Asamura patent firm (JP)
Patent business corporation Asamura patent firm (JP)
Download PDF:
Previous Patent: MOLDED BODY, METHOD OF MANUFACTURING MOLD, MOLD, AND OPTICAL ELEMENT
Next Patent: ELECTRONIC CONTROL DEVICE
Next Patent: ELECTRONIC CONTROL DEVICE