Title:
SLIT MACHINING DEVICE AND SLIT MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/002618
Kind Code:
A1
Abstract:
This slit machining device (100) machines a slit in an optical film (F1) while performing undulation control using a first detection device (106). The first detection device (106) includes: a first support body (111) that supports the first surface of an optical film (F1); a first light source unit (112a) that illuminates light from the second surface side of the optical film (F1) towards the optical film (F1) positioned on a first reflective surface (RS); a first polarizing plate (112c) provided on the optical path of light from the first light source unit (112a) towards the optical film (F1); a first imaging unit (112b) that images the reflected light image of the optical film (F1) positioned on the first reflective surface (RS1) from the second surface side of the optical film (F1); and a first pattern detection unit (114) that detects a plurality of polarized pattern sequences (F14a, F14b) positioned on the first reflective surface (RS) on the basis of the reflected light image of the optical film (F1) imaged by the first imaging unit (112b).
Inventors:
CHEN TING HUAI (JP)
NISHIHARA NOBUHIKO (JP)
NISHIHARA NOBUHIKO (JP)
Application Number:
PCT/JP2015/068326
Publication Date:
January 07, 2016
Filing Date:
June 25, 2015
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
G01N21/84; G01B11/00; G01M11/00; G02B5/30; G02F1/13; G02F1/13363
Domestic Patent References:
| WO2013191132A1 | 2013-12-27 |
Foreign References:
| JP2014095617A | 2014-05-22 | |||
| JP2012242679A | 2012-12-10 | |||
| JP2013015563A | 2013-01-24 | |||
| JP2014062817A | 2014-04-10 | |||
| JP2003344301A | 2003-12-03 | |||
| JP2013117714A | 2013-06-13 | |||
| JP2012073576A | 2012-04-12 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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