Title:
SLURRY COMPOSITION FOR POLISHING ORGANIC FILM AND METHOD FOR POLISHING ORGANIC FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/101583
Kind Code:
A1
Abstract:
A slurry composition for polishing an organic film of the present invention comprises an oxidant, an organic acid, a polishing accelerator comprising a repeating unit derived from maleic acid or maleic anhydride, and water, wherein the polishing accelerator is included with a smaller weight than the organic acid.
Inventors:
KIM JEONG HEE (KR)
KANG DONG HUN (KR)
CHOI JUNG MIN (KR)
YOO YONG SIK (KR)
KANG DONG HUN (KR)
CHOI JUNG MIN (KR)
YOO YONG SIK (KR)
Application Number:
PCT/KR2017/009991
Publication Date:
June 07, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C09G1/18; B24B57/02; H01L21/304; H01L21/306
Foreign References:
| KR20090033016A | 2009-04-01 | |||
| KR20140135743A | 2014-11-26 | |||
| KR20090127089A | 2009-12-09 | |||
| KR20160135081A | 2016-11-24 | |||
| US20090239373A1 | 2009-09-24 |
Attorney, Agent or Firm:
AJU INTERNATIONAL LAW & PATENT GROUP (KR)
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