SLURRY COMPOSITION FOR POLISHING TUNGSTEN BARRIER LAYER

Title:

SLURRY COMPOSITION FOR POLISHING TUNGSTEN BARRIER LAYER

Document Type and Number:

WIPO Patent Application WO/2018/026099

Kind Code:

A1

Abstract:

The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a sulfur-containing amino acid, and can improve edge over erosion (EOE).

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Inventors:

PARK HAN TEO (KR)
KONG HYUN GOO (KR)
LEE SANG MI (KR)

Application Number:

PCT/KR2017/006314

Publication Date:

February 08, 2018

Filing Date:

June 16, 2017

Export Citation:

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Assignee:

K C TECH CO LTD (KR)

International Classes:

C09G1/02; C09K3/14; C23F3/04

Foreign References:

KR20160015908A	2016-02-15
KR20140079001A	2014-06-26
KR100770571B1	2007-10-26
JP2002511650A	2002-04-16
KR20140079003A	2014-06-26

Other References: