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Patent Searching and Data


Title:
SLURRY COMPOSITION FOR POLISHING TUNGSTEN BARRIER LAYER
Document Type and Number:
WIPO Patent Application WO/2018/026099
Kind Code:
A1
Abstract:
The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a sulfur-containing amino acid, and can improve edge over erosion (EOE).

Inventors:
PARK, Han Teo (39 Jae2gongdan 2-gil, Miyang-myeonAnseong-si, Gyeonggi-do, 17599, KR)
KONG, Hyun Goo (39 Jae2gongdan 2-gil, Miyang-myeonAnseong-si, Gyeonggi-do, 17599, KR)
LEE, Sang Mi (39 Jae2gongdan 2-gil, Miyang-myeonAnseong-si, Gyeonggi-do, 17599, KR)
Application Number:
KR2017/006314
Publication Date:
February 08, 2018
Filing Date:
June 16, 2017
Export Citation:
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Assignee:
K.C.TECH CO., LTD (39 Jae2gongdan 2-gil, Miyang-myeonAnseong-si, Gyeonggi-do, 17599, KR)
International Classes:
C09G1/02; C09K3/14; C23F3/04
Foreign References:
KR20160015908A2016-02-15
KR20140079001A2014-06-26
KR100770571B12007-10-26
JP2002511650A2002-04-16
KR20140079003A2014-06-26
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (5th Floor, 9 Hakdong-ro 3-gilGangnam-gu, Seoul, 06044, KR)
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