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Title:
SLURRY COMPOSITIONS FOR USE IN A CHEMICAL-MECHANICAL PLANARIZATION PROCESS HAVING NON-SPHERICAL ABRASIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO2004083328
Kind Code:
A3
Abstract:
A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology.

Inventors:
MATHUR SHARAD
MOINI HAMAD
PETROVIC IVAN
Application Number:
PCT/US2004/007468
Publication Date:
November 11, 2004
Filing Date:
March 11, 2004
Export Citation:
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Assignee:
ENGELHARD CORP (US)
International Classes:
C09G1/02; C09K3/14; H01L21/321; H01L21/768; H01L21/3105; (IPC1-7): C09G1/02; C09K3/14; H01L21/304; H01L21/306; H01L21/321; H01L21/768
Domestic Patent References:
WO2001048807A12001-07-05
WO2003064551A12003-08-07
WO2004063301A12004-07-29
Foreign References:
US4549374A1985-10-29
EP0773269A21997-05-14
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