SLURRY MANAGEMENT DEVICE FOR WIRE SAW - IHI COMPRESSOR AND MACHINERY CO LTD

Title:

SLURRY MANAGEMENT DEVICE FOR WIRE SAW

Document Type and Number:

WIPO Patent Application WO/2012/081239

Kind Code:

A1

Abstract:

A wire saw slurry management device is provided with: a first tank (5A) which receives slurry waste (3); a centrifugal separator (14) into which the slurry waste (3b) from the first tank (5A) is introduced and which isolates the slurry (2); a second tank (5B) which receives the solid-content slurry (2) from the centrifugal separator (14); a slurry supply path (26) which supplies the slurry (2) from the second tank (5B) to a fixed-abrasive wire saw (1); a controller (41) which detects the slurry density using a detection value from a density meter (29) and a viscometer (30), both provided on a circulation flow path (28) for extracting and circulating the slurry (2) from the second tank (5B); a slurry discharge path (33) which discharges some of the slurry (2) from the second tank (5B) as waste slurry (31); and a new slurry supply path (38) which supplies new slurry (2a) to the second tank (5B). The discharge of waste slurry (31) by the slurry discharge path (33) and the supply of new slurry (2a) by the new slurry supply path (38) are implemented in order to maintain a specific density for the slurry density detected using the controller (41).

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Inventors:

TAKASU MIKIO (JP)
TANAKA MASAYA (JP)
UEDA HIROAKI (JP)
MATSUSHITA TSUTOMU (JP)
KAWABUCHI SHINJI (JP)

Application Number:

PCT/JP2011/006964

Publication Date:

June 21, 2012

Filing Date:

December 14, 2011

Export Citation:

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Assignee:

IHI COMPRESSOR AND MACHINERY CO LTD (JP)
TAKASU MIKIO (JP)
TANAKA MASAYA (JP)
UEDA HIROAKI (JP)
MATSUSHITA TSUTOMU (JP)
KAWABUCHI SHINJI (JP)

International Classes:

B24B27/06; B24B55/03; B28D5/04; B28D7/02; H01L21/304

Foreign References:

JP2002144229A	2002-05-21
JP2010253622A	2010-11-11
JP2010253621A	2010-11-11
JP2010029998A	2010-02-12
JP2000141362A	2000-05-23

Attorney, Agent or Firm:

Patent firm YAMADA PATENT OFFICE (JP)
Patent business corporation Yamada patent firm (JP)

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