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Title:
SLURRY MANAGEMENT DEVICE FOR WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2012/081239
Kind Code:
A1
Abstract:
A wire saw slurry management device is provided with: a first tank (5A) which receives slurry waste (3); a centrifugal separator (14) into which the slurry waste (3b) from the first tank (5A) is introduced and which isolates the slurry (2); a second tank (5B) which receives the solid-content slurry (2) from the centrifugal separator (14); a slurry supply path (26) which supplies the slurry (2) from the second tank (5B) to a fixed-abrasive wire saw (1); a controller (41) which detects the slurry density using a detection value from a density meter (29) and a viscometer (30), both provided on a circulation flow path (28) for extracting and circulating the slurry (2) from the second tank (5B); a slurry discharge path (33) which discharges some of the slurry (2) from the second tank (5B) as waste slurry (31); and a new slurry supply path (38) which supplies new slurry (2a) to the second tank (5B). The discharge of waste slurry (31) by the slurry discharge path (33) and the supply of new slurry (2a) by the new slurry supply path (38) are implemented in order to maintain a specific density for the slurry density detected using the controller (41).

Inventors:
TAKASU, Mikio (7-12, Shinonome 1-chome, Koto-k, Tokyo 62, 〒1350062, JP)
高須 幹雄 (〒62 東京都江東区東雲1丁目7番12号株式会社IHI回転機械内 Tokyo, 〒1350062, JP)
TANAKA, Masaya (7-12, Shinonome 1-chome, Koto-k, Tokyo 62, 〒1350062, JP)
田中 雅也 (〒62 東京都江東区東雲1丁目7番12号株式会社IHI回転機械内 Tokyo, 〒1350062, JP)
UEDA, Hiroaki (7-12, Shinonome 1-chome, Koto-k, Tokyo 62, 〒1350062, JP)
Application Number:
JP2011/006964
Publication Date:
June 21, 2012
Filing Date:
December 14, 2011
Export Citation:
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Assignee:
IHI COMPRESSOR AND MACHINERY CO., LTD. (7-12, Shinonome 1-chome Koto-k, Tokyo 62, 〒1350062, JP)
株式会社IHI回転機械 (〒62 東京都江東区東雲1丁目7番12号 Tokyo, 〒1350062, JP)
TAKASU, Mikio (7-12, Shinonome 1-chome, Koto-k, Tokyo 62, 〒1350062, JP)
高須 幹雄 (〒62 東京都江東区東雲1丁目7番12号株式会社IHI回転機械内 Tokyo, 〒1350062, JP)
TANAKA, Masaya (7-12, Shinonome 1-chome, Koto-k, Tokyo 62, 〒1350062, JP)
田中 雅也 (〒62 東京都江東区東雲1丁目7番12号株式会社IHI回転機械内 Tokyo, 〒1350062, JP)
International Classes:
B24B27/06; B24B55/03; B28D5/04; B28D7/02; H01L21/304
Attorney, Agent or Firm:
patent firm YAMADA PATENT OFFICE (2nd Yahagi Bldg, 5-3 Uchikanda 3-chome, Chiyoda-k, Tokyo 47, 〒1010047, JP)
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Claims: