Title:
SLURRY AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/056122
Kind Code:
A1
Abstract:
Provided is a slurry containing abrasive particles, glycol, and water, wherein the average particle size of the abrasive particles is 120 nm or less, and the pH of the slurry is at least 4.0 and less than 8.0. Also provided is a polishing method comprising a step for using the slurry to polish a metal.
Inventors:
OOUCHI MAYUMI (JP)
Application Number:
PCT/JP2017/032914
Publication Date:
March 29, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO2003036705A1 | 2003-05-01 | |||
| WO2014077107A1 | 2014-05-22 |
Foreign References:
| JP2006278773A | 2006-10-12 | |||
| JP2015528835A | 2015-10-01 |
Other References:
"1, Silica Products under Development", CREATIVE, 2007, pages 62 - 71, Retrieved from the Internet [retrieved on 20171010]
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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