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Title:
SLURRY FOR PREPARING CAPILLARY STRUCTURE AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/011715
Kind Code:
A1
Abstract:
A slurry for preparing a capillary structure, a preparation method for the slurry, a preparation method for the capillary structure and a vapor chamber. The slurry comprises a metal powder, a compound powder, an adhesive and an organic solvent, wherein the mass fraction of the metal powder is 20% to 80%; the mass fraction of the compound powder is 10% to 70%; the mass fraction of the adhesive is 0.1% to 20%; and the mass fraction of the organic solvent is 5% to 40%. The organic solvent is used for dissolving the adhesive; the adhesive is used for connecting the metal powder, the compound powder and the vapor chamber; the metal powder is used for forming a matrix of a capillary structure in the vapor chamber after being dried; and the compound powder is used for forming grooves and through holes in the matrix. The capillary structure prepared from the slurry has the characteristic of controllable size, such that the capillary structure can satisfy the size requirements of a light and thin vapor chamber; in addition, the capillary structure has through holes and grooves, which is beneficial for improving the liquid absorption performance of the capillary structure, thereby being beneficial for improving the overall heat transfer performance of the vapor chamber.

Inventors:
HUANG GUOCHUANG (CN)
WANG HEZHI (CN)
ZHANG BO (CN)
XU SHASHA (CN)
Application Number:
PCT/CN2022/114181
Publication Date:
January 18, 2024
Filing Date:
August 23, 2022
Export Citation:
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Assignee:
RAYTECH PRECISION TECH SHUYANG CO LTD (CN)
International Classes:
F28D15/04; B22F1/065; B22F9/04
Domestic Patent References:
WO2021042946A12021-03-11
Foreign References:
CN112444152A2021-03-05
TWI743945B2021-10-21
TWI720823B2021-03-01
CN114543570A2022-05-27
CN101704103A2010-05-12
JP2008122030A2008-05-29
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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