SMART CARD MANUFACTURING METHOD USING INJECTION MOLDING

WIPO Patent Application WO/2011/159069

A2

The present invention pertains to a smart card manufacturing method, wherein a card main body may be manufactured to be thin by injection molding in a short period of time, so as to increase productivity and aesthetic sensibility, and improve durability. According to one aspect of the present invention, a method for manufacturing a card main body of a smart card for mounting a structure including a circuit module attached with one or more IC chips includes the steps of: forming an individual sheet by forming a plurality of through-holes for injection molding along the edge of an area on a substrate, in which the card main body is formed, and forming one or more through-holes for chip insertion at positions for IC chips to be inserted; and forming injection molds on the edge with a predetermined thickness and predetermined width by injection-molding a melt along the edge of the individual sheet.

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PARK, Young Bok (1 Sinseong Hogye Misojium Apt, 923-21 Hogye-dong,,Dongan-gu, Anyang-si, Gyeonggi-do 431-837, 431-837, KR)
박영복 (경기도 안양시 동안구 호계동 923-21 신성호계미소지움아파트, 431-837 Gyeonggi-do, 431-837, KR)

KR2011/004285

December 22, 2011

June 10, 2011

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PARK, Young Bok (1 Sinseong Hogye Misojium Apt, 923-21 Hogye-dong,,Dongan-gu, Anyang-si, Gyeonggi-do 431-837, 431-837, KR)
박영복 (경기도 안양시 동안구 호계동 923-21 신성호계미소지움아파트, 431-837 Gyeonggi-do, 431-837, KR)

B29C45/14; B29C45/00

MYUNG MOON IP & LAW FIRM (8F Songchon Bldg, 642-9 Yeoksam-dong Gangnam-gu, Seoul 135-080, 135-080, KR)

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