Title:
SMD QUARTZ CRYSTAL RESONATOR AND COMPLETE BOARD PACKAGE MACHINING PROCESS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/076361
Kind Code:
A1
Abstract:
A complete board package machining process for an SMD quartz crystal resonator. The complete board package machining process comprises the following machining steps: (1), machining a plurality of quartz crystal bases (2) arranged, in a matrix manner, on a ceramic complete board (1); (2), forming a plurality of metal sheets (5), in the same matrix shape as each base (2) on the ceramic complete board (1), on a metal complete board (4), the adjacent metal sheets (5) being connected by means of a metal connecting wire (6); (3), machining a quartz crystal resonant part on the ceramic complete board (1); and (4) packaging the ceramic complete board (1) and the metal complete board (4), and finally, partitioning same into a single SMD quartz crystal resonator. The SMD resonator is low in manufacturing cost and small in stress, contributes to long-term stability of product frequency, and has a simple and convenient manufacturing process.
Inventors:
HUANG YI (CN)
LI BIN (CN)
LI BIN (CN)
Application Number:
PCT/CN2016/104821
Publication Date:
May 11, 2017
Filing Date:
November 07, 2016
Export Citation:
Assignee:
MDH TECH CO LTD (CN)
International Classes:
H03H3/02
Foreign References:
| CN105305995A | 2016-02-03 | |||
| CN102355225A | 2012-02-15 | |||
| CN201345640Y | 2009-11-11 | |||
| JP2009182873A | 2009-08-13 |
Attorney, Agent or Firm:
YANTAI SHANGHE INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
Download PDF:
Previous Patent: COMBINATION THERAPY FOR MALIGNANT DISEASES
Next Patent: SYSTEMS AND METHODS FOR SELF-CONTAINED AIR INTERFACE PARTITIONS
Next Patent: SYSTEMS AND METHODS FOR SELF-CONTAINED AIR INTERFACE PARTITIONS