Sn-Ag BASED LEAD-FREE SOLDER - MITSUI MINING & SMELTING CO

Title:

Sn-Ag BASED LEAD-FREE SOLDER

Document Type and Number:

WIPO Patent Application WO/2004/002674

Kind Code:

A1

Abstract:

An Sn-Ag based lead-free solder, which comprises zinc (Zn). The Sn-Ag based lead-free solder allows the improvement of initial joint strength and the suppression of the lowering of joint strength after the heat-treatment of the joint, in the joining interface with an electrolessly plated article.

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Inventors:

NAKAHARA YUNOSUKE (JP)
NINOMIYA RYUJI (JP)

Application Number:

PCT/JP2003/008366

Publication Date:

January 08, 2004

Filing Date:

July 01, 2003

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO (JP)
NAKAHARA YUNOSUKE (JP)
NINOMIYA RYUJI (JP)

International Classes:

B23K1/00; B23K1/20; B23K35/26; C22C13/00; C23C18/32; (IPC1-7): B23K35/26

Foreign References:

EP0612578A1	1994-08-31
JP2002185130A	2002-06-28

Other References: