Sn-PLATED ARTICLE AND METHOD FOR MANUFACTURING SAME

Title:

Sn-PLATED ARTICLE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2015/133499

Kind Code:

A1

Abstract:

　An Sn-plated article obtained by performing Sn-plating on the surface of a substrate (10) comprising copper or a copper alloy, wherein a base layer (12) comprising Ni and/or a Cu-Ni alloy is formed on the surface of the substrate (10), an outermost layer comprising a Cu-Sn alloy (14) made of numerous Cu-Sn alloy crystal grains and an Sn layer (16) in recesses between adjacent Cu-Sn alloy crystal grains on the outermost surface is formed on the surface of the base layer (12), the Sn layer (16) occupies 20-80% of the area of the outermost surface, and the maximum thickness of the Sn layer (16) is less than the average grain size of the Cu-Sn alloy crystal grains.

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Inventors:

MURATA TATSUNORI (JP)
KOTANI HIROTAKA (JP)
ENDO HIDEKI (JP)
SUGAWARA AKIRA (JP)
SONODA YUTA (JP)
KATO TETSUO (JP)
OHSUMI HIDEKI (JP)
TOYOIZUMI JYUN (JP)

Application Number:

JP2015/056271

Publication Date:

September 11, 2015

Filing Date:

February 25, 2015

Export Citation:

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Assignee:

DOWA METALTECH CO LTD (JP)
YAZAKI CORP (JP)

International Classes:

C25D5/12; C25D5/50; C25D7/00

Foreign References:

US20140004373A1	2014-01-02
JP2013185193A	2013-09-19
JP2007063624A	2007-03-15
JP2007247060A	2007-09-27

Attorney, Agent or Firm:

OKAWA, KOICHI (JP)
Koichi Okawa (JP)

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