Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Sn-PLATED ARTICLE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/133499
Kind Code:
A1
Abstract:
 An Sn-plated article obtained by performing Sn-plating on the surface of a substrate (10) comprising copper or a copper alloy, wherein a base layer (12) comprising Ni and/or a Cu-Ni alloy is formed on the surface of the substrate (10), an outermost layer comprising a Cu-Sn alloy (14) made of numerous Cu-Sn alloy crystal grains and an Sn layer (16) in recesses between adjacent Cu-Sn alloy crystal grains on the outermost surface is formed on the surface of the base layer (12), the Sn layer (16) occupies 20-80% of the area of the outermost surface, and the maximum thickness of the Sn layer (16) is less than the average grain size of the Cu-Sn alloy crystal grains.

Inventors:
MURATA TATSUNORI (JP)
KOTANI HIROTAKA (JP)
ENDO HIDEKI (JP)
SUGAWARA AKIRA (JP)
SONODA YUTA (JP)
KATO TETSUO (JP)
OHSUMI HIDEKI (JP)
TOYOIZUMI JYUN (JP)
Application Number:
JP2015/056271
Publication Date:
September 11, 2015
Filing Date:
February 25, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DOWA METALTECH CO LTD (JP)
YAZAKI CORP (JP)
International Classes:
C25D5/12; C25D5/50; C25D7/00
Foreign References:
US20140004373A12014-01-02
JP2013185193A2013-09-19
JP2007063624A2007-03-15
JP2007247060A2007-09-27
Attorney, Agent or Firm:
OKAWA, KOICHI (JP)
Koichi Okawa (JP)
Download PDF: