Title:
SN-AG-CU-BASED SOLDER POWDER, AND SOLDER PASTE USING SAID POWDER
Document Type and Number:
WIPO Patent Application WO/2014/115695
Kind Code:
A1
Abstract:
An Sn-Ag-Cu-based solder powder is obtained by depositing, as an additive agent, on surfaces of a solder powder having an average particle size of not more than 5 µm, a dry substance of a solution of hydroxybenzoic acid having a melting point of not more than 250 ˚C or an ester thereof. It is preferable that the additive agent be salicylic acid, 3,4 dihydroxybenzoic acid ether, or 3,5 dihydroxybenzoic ether. It is preferable that: the deposited amount of the additive agent be 0.01-1.0 parts by mass per 100 parts by mass of the total amount of tin, silver, and copper components included in the solder powder; the content ratio of silver be 0.1-10 mass% when the total amount of tin, silver, and copper components is 100 mass%; the content ratio of copper be 0.1-2.0 mass% when the total amount of tin, silver, and copper components is 100 mass%; and the remainder comprise tin.
Inventors:
IWATA KOUTAROU (JP)
MURAOKA HIROKI (JP)
KUBA KANJI (JP)
MURAOKA HIROKI (JP)
KUBA KANJI (JP)
Application Number:
PCT/JP2014/051037
Publication Date:
July 31, 2014
Filing Date:
January 21, 2014
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K35/14; B22F1/05; B22F1/107; B23K35/22; B23K35/26; C22C13/00; H05K3/34
Domestic Patent References:
| WO1995020460A1 | 1995-08-03 |
Foreign References:
| JP2012152782A | 2012-08-16 | |||
| JPH11245079A | 1999-09-14 | |||
| JP2008272779A | 2008-11-13 | |||
| JP2006009125A | 2006-01-12 | |||
| JP2005254246A | 2005-09-22 | |||
| JP2012115861A | 2012-06-21 | |||
| JP2014008506A | 2014-01-20 |
Attorney, Agent or Firm:
SUDA, MASAYOSHI (JP)
Masayoshi Suda (JP)
Masayoshi Suda (JP)
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