Title:
SN-PLATED ARTICLE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/038048
Kind Code:
A1
Abstract:
A Sn-plated article on which a topmost layer (14) containing Sn is formed on the surface of a ground layer (12) composed of Ni formed on the surface of a substrate (10) composed of copper or a copper alloy, wherein the topmost layer (14) comprises a Cu-Sn alloy layer (14a) composed of numerous crystal grains of a Cu-Sn alloy, a Sn layer (14b) composed of Sn formed in recesses between the crystal grains of the Cu-Sn alloy adjacent to each other in the topmost surface of the Cu-Sn alloy layer (14a) and having an average thickness of 0.01-0.20 µm, and a plurality of Cu-Ni-Sn alloy layers (14c) composed of a Cu-Ni-Sn alloy and disposed at a distance from each other on the ground layer (12) side inside the Cu-sn alloy layer (14a).
Inventors:
SONODA YUTA (JP)
NARIEDA HIROTO (JP)
ENDO HIDEKI (JP)
SUGAWARA AKIRA (JP)
KOTANI HIROTAKA (JP)
TOYOIZUMI JYUN (JP)
KONDO TAKAYA (JP)
KISHIBATA YUYA (JP)
NARIEDA HIROTO (JP)
ENDO HIDEKI (JP)
SUGAWARA AKIRA (JP)
KOTANI HIROTAKA (JP)
TOYOIZUMI JYUN (JP)
KONDO TAKAYA (JP)
KISHIBATA YUYA (JP)
Application Number:
PCT/JP2016/003830
Publication Date:
March 09, 2017
Filing Date:
August 23, 2016
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
YAZAKI CORP (JP)
YAZAKI CORP (JP)
International Classes:
C25D5/50; C25D5/12; C25D7/00; H01R13/03; H01R43/16
Domestic Patent References:
| WO2015133499A1 | 2015-09-11 |
Foreign References:
| JP2013231223A | 2013-11-14 | |||
| JP2007247060A | 2007-09-27 | |||
| JP2015149200A | 2015-08-20 | |||
| JP2013185193A | 2013-09-19 | |||
| JP2014240520A | 2014-12-25 |
Attorney, Agent or Firm:
OKAWA, Koichi (JP)
Download PDF:
Previous Patent: FLEXIBLE LINEAR LIGHT-EMITTING OBJECT AND PROCESS FOR PRODUCING SAME
Next Patent: ROLL CRUSHER OF COOLER DEVICE
Next Patent: ROLL CRUSHER OF COOLER DEVICE