Title:
SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/178305
Kind Code:
A1
Abstract:
Provided are an Sn plating material having superior micro slide-movement abrasion resistance when being used as a material for insertable/removable connection terminals and the like, and a method for producing the Sn plating material. On a base material 10 formed of copper or a copper alloy, a Ni layer 16 is formed so as to have a thickness of 0.1-1.5 µm through electroplating, a Sn-Cu plating layer 12 in which a Cu-Sn alloy 12a and a Sn 12b are intermixed is formed so as to have a thickness of 0.6-10 µm through electroplating using a Sn-Cu plating bath in which the Cu content with respect to the total of Sn and Cu is 5-35 mass%, and then, if necessary, a Sn layer 14 is formed through electroplating so as to have a thickness not larger than 1 µm.
Inventors:
KOTANI HIROTAKA (JP)
NARIEDA HIROTO (JP)
ENDO HIDEKI (JP)
SUGAWARA AKIRA (JP)
SONODA YUTA (JP)
KONDO TAKAYA (JP)
TOYOIZUMI JYUN (JP)
KISHIBATA YUYA (JP)
NARIEDA HIROTO (JP)
ENDO HIDEKI (JP)
SUGAWARA AKIRA (JP)
SONODA YUTA (JP)
KONDO TAKAYA (JP)
TOYOIZUMI JYUN (JP)
KISHIBATA YUYA (JP)
Application Number:
PCT/JP2016/002103
Publication Date:
November 10, 2016
Filing Date:
April 20, 2016
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
YAZAKI CORP (JP)
YAZAKI CORP (JP)
International Classes:
C25D5/10; C25D5/12; C25D7/00; H01R13/03
Foreign References:
| JP2010248616A | 2010-11-04 | |||
| JP2009046745A | 2009-03-05 | |||
| JP2006265616A | 2006-10-05 | |||
| JP2004091882A | 2004-03-25 | |||
| JP2002080993A | 2002-03-22 |
Other References:
See also references of EP 3293291A4
Attorney, Agent or Firm:
OKAWA, KOICHI (JP)
Koichi Okawa (JP)
Koichi Okawa (JP)
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