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Patent Searching and Data


Title:
SN PLATING MATERIAL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/105388
Kind Code:
A1
Abstract:
Provided are: a Sn plating material which has a Zn plating layer formed at a surface thereof, and which when used as a material for a terminal which is connected to an electric wire formed of aluminum or an aluminum alloy by pressure-attachment processing, such as crimping, has good corrosion resistance, and good adhesion of the Zn plating layer formed on the surface, without performing any treatment on the connection portion during the pressure-attachment processing; and a production method for the Sn plating material. This Sn plating material has a Sn-containing layer 12 formed on a surface of a substrate 10 formed of copper or a copper alloy, wherein the Sn-containing layer 12 is formed of a Cu-Sn alloy layer 121 and a Sn layer 122 that comprises Sn, that has a thickness of 5 μm or less, and that is formed on a surface of the Cu-Sn alloy layer, a Ni plating layer 14 is formed on a surface of the Sn-containing layer 12, and a Zn plating layer 16 is formed as the outermost layer on a surface of the Ni plating layer 14.

Inventors:
NARIEDA Hiroto (14-1, Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
SONODA Yuta (14-1, Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
DOI Tatsuhiro (14-1, Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
TOMIYA Takao (14-1, Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
Application Number:
JP2017/041827
Publication Date:
June 14, 2018
Filing Date:
November 21, 2017
Export Citation:
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Assignee:
DOWA METALTECH CO., LTD. (14-1, Sotokanda 4-chome Chiyoda-k, Tokyo 21, 〒1010021, JP)
International Classes:
C25D5/12; C25D3/22; C25D5/50; C25D7/00; H01R13/03
Attorney, Agent or Firm:
OKAWA Koichi (Okawa Patent Office, Aoyagi Bldg. 14-6, Hatchobori 2-chome, Chuo-k, Tokyo 32, 〒1040032, JP)
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