Title:
SNAG ALLOY PLATING LIQUID
Document Type and Number:
WIPO Patent Application WO/2017/115701
Kind Code:
A1
Abstract:
This SnAg alloy plating liquid comprising a water-soluble tin compound and a water-soluble silver compound is characterized in comprising a specific sulfide compound in the range of 0.25 moles to 10 moles per 1 mole of silver in the water-soluble silver compound.
Inventors:
TATSUMI KOJI (JP)
YASOSHIMA TSUKASA (JP)
KATASE TAKUMA (JP)
YASOSHIMA TSUKASA (JP)
KATASE TAKUMA (JP)
Application Number:
PCT/JP2016/088102
Publication Date:
July 06, 2017
Filing Date:
December 21, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D3/60
Domestic Patent References:
| WO2014165867A1 | 2014-10-09 | |||
| WO2010074067A1 | 2010-07-01 |
Foreign References:
| JP2013167019A | 2013-08-29 | |||
| JP2015158012A | 2015-09-03 | |||
| JP2003084406A | 2003-03-19 |
Other References:
See also references of EP 3399071A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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