SNZN SOLDER AND PRODUCTION METHOD THEREFOR

WIPO Patent Application WO/2021/256172

A1

The present invention relates to an SnZn solder and an SnZn solder production method, the objective being to provide a solder that is inexpensive, extremely rigid on an electrode of a solar battery base board, or the like, and strong in a high temperature-low temperature repeating test, moreover, even when the solder is contaminated, the melting temperature is approximately identical, or decreases.　The SnZn solder is characterized in that, into a matrix material that is an alloy of Sn and Zn having a purity of 4 N or higher, a total of 1 to 1.5% by weight or less of a main material containing one or more among P, In, and Bi, has been mixed, and then, the mixture has been melted and alloyed.

OKADA MORIHIRO (JP)
ARAI KATSUYA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
MORI NAOHISA (JP)

PCT/JP2021/019414

December 23, 2021

May 21, 2021

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ARTBEAM CO LTD (JP)
OKADA MORIHIRO (JP)

B23K1/00; B23K35/26; B23K35/363; B23K35/40; C22C13/00; C22C13/02; H01L31/02

WO2003061896A1	2003-07-31
WO1997012719A1	1997-04-10
WO2018159306A1	2018-09-07
WO2007004394A1	2007-01-11

CN101092006A	2007-12-26
JPH10193172A	1998-07-28
JPH09155587A	1997-06-17
JPS6340639B2	1988-08-11
JP2018111872A	2018-07-19

OKADA Morihiro (JP)

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