Title:
SOCKET DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/088191
Kind Code:
A1
Abstract:
A socket device (1, 1a-1g) includes a plurality of conductors (2), an insulating socket main body (4), which is bonded to a plurality of the conductors to hold the conductors, demarcates a cavity (5) having an opening at least on one plane to expose a part of the conductor and can connect an electric element (3, 13, 22, 40) with the exposed conductors in the cavity, and a cap (6, 6a-6n, 6p), which has a cap main body (7) covering at least a part of the above mentioned one plane of the socket main body and is mounted on the socket main body.
Inventors:
MORIYAMA HIDEO (JP)
HOSHIKAWA KIYOTOSHI (JP)
HOSHIKAWA KIYOTOSHI (JP)
Application Number:
PCT/JP2005/004296
Publication Date:
September 22, 2005
Filing Date:
March 11, 2005
Export Citation:
Assignee:
MORIYAMA SANGYO KK (JP)
MORIYAMA HIDEO (JP)
HOSHIKAWA KIYOTOSHI (JP)
MORIYAMA HIDEO (JP)
HOSHIKAWA KIYOTOSHI (JP)
International Classes:
F21V8/00; F21V15/01; F21V17/16; H01R33/05; H01R33/09; F21V14/06; F21V19/00; H01L33/58; H01R13/627; H05K3/30; (IPC1-7): F21V19/00; H01L33/00; H01R33/05
Foreign References:
| JPH028068U | 1990-01-18 | |||
| JPH0523311U | 1993-03-26 | |||
| JPH06242241A | 1994-09-02 | |||
| JP2000149608A | 2000-05-30 | |||
| JPH11163417A | 1999-06-18 |
Attorney, Agent or Firm:
Oshima, Yoichi (2-20 Kanda-Jimbocho Chiyoda-ku, Tokyo 51, JP)
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