Title:
SOFT ERROR INSPECTION METHOD, SOFT ERROR INSPECTION DEVICE, AND SOFT ERROR INSPECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/026213
Kind Code:
A1
Abstract:
This soft error inspection method for a semiconductor device is characterized by comprising: a step for polishing the back surface of the semiconductor device, thereafter, a step for measuring the thicknesses of a plurality of parts of a soft error inspection area of the semiconductor device, a step for irradiating laser light of wavelengths corresponding to the thicknesses of the semiconductor device onto the back surface of the semiconductor device, and a step for measuring bit flip times for the parts of the semiconductor device irradiated with the laser light. With this method, the present invention solves the problem in the existing state of the art.
Inventors:
SOEDA TAKESHI (JP)
Application Number:
PCT/JP2017/028111
Publication Date:
February 07, 2019
Filing Date:
August 02, 2017
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
G01R31/26; H01L21/66
Foreign References:
| JP2017040543A | 2017-02-23 | |||
| US5982691A | 1999-11-09 | |||
| JPH01248070A | 1989-10-03 | |||
| JP2009168562A | 2009-07-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF: