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Title:
SOFT MAGNETIC ALLOY THIN STRIP, METHOD FOR PRODUCING SAME, AND MAGNETIC COMPONENT HAVING SOFT MAGNETIC ALLOY THIN STRIP
Document Type and Number:
WIPO Patent Application WO/2010/084888
Kind Code:
A1
Abstract:
Disclosed is a method for producing a soft magnetic alloy thin strip which has a composition represented by Fe100-x-y-zAxByXz (wherein A represents Cu and/or Au; X represents at least one element selected from among Si, S, C, P, Al, Ge, Ga and Be; and x, y and z respectively represent the numbers expressing the atom% of the elements and satisfying 0 < x ≤ 5, 10 ≤ y ≤ 22, 1 ≤ z ≤ 10 and x + y + z ≤ 25), and comprises a matrix wherein fine crystal grains having an average grain size of 60 nm or less are dispersed at a volume fraction of 50% or more. In the soft magnetic alloy thin strip, a part of the oxide coating film formed on the surface is a layer that has a B concentration lower than the average B concentration of the matrix. In the method for producing a soft magnetic alloy thin strip, (1) an initial microcrystalline alloy thin strip, which has a matrix wherein fine crystal nuclei having an average grain size of 30 nm or less are dispersed in an amorphous phase at a volume fraction of more than 0% but less than 30%, is formed by jetting and quenching an alloy melt having the above-described composition on a rotating cooling roll, and then (2) the initial microcrystalline alloy thin strip is subjected to a heat treatment in an atmosphere having an oxygen concentration of 6-18%.

Inventors:
OHTA Motoki (Materials Development Laboratory New Business Development Center, 2-15-17, Egawa, Shimamoto-ch, Mishima-gun Osaka 13, 〒6180013, JP)
太田 元基 (〒13 大阪府三島郡島本町江川2-15-17 日立金属株式会社 新事業開発センター材料開発室内 Osaka, 〒6180013, JP)
Application Number:
JP2010/050647
Publication Date:
July 29, 2010
Filing Date:
January 20, 2010
Export Citation:
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Assignee:
HITACHI METALS, LTD. (2-1 Shibaura 1-chome, Minato-ku Tokyo, 14, 〒1058614, JP)
日立金属株式会社 (〒14 東京都港区芝浦1丁目2-1 Tokyo, 〒1058614, JP)
OHTA Motoki (Materials Development Laboratory New Business Development Center, 2-15-17, Egawa, Shimamoto-ch, Mishima-gun Osaka 13, 〒6180013, JP)
International Classes:
H01F1/153; C21D6/00; C22C38/00; C22C45/02; H01F1/18; H01F27/24
Attorney, Agent or Firm:
TAKAISHI Kitsuma (Kagurazaka FN Bldg. 5F, 67 Kagurazaka 6-chom, Shinjuku-ku Tokyo 25, 〒1620825, JP)
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