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Title:
SOFT MAGNETIC POWDER, SOFT MAGNETIC POWDER HEAT TREATMENT METHOD, SOFT MAGNETIC MATERIAL, DUST CORE, AND DUST CORE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/090849
Kind Code:
A1
Abstract:
This soft magnetic powder comprises a Fe alloy containing Si, wherein the soft magnetic powder contains 0.1-15 mass% of Si, and the ratio (Si/Fe) of the atomic concentration of Si and the atomic concentration of Fe at a depth of 1 nm from the particle surface of the soft magnetic powder is 4.5-30.

More Like This:
WO/1996/021054OPTICALLY FUSED SEMICONDUCTOR POWDER FOR SOLAR CELLS
JPH04116102MAGNETIC POWDER FOR ANISOTROPIC BOND MAGNET AND ITS PRODUCTION
Inventors:
KAWAUCHI TAKESHI (JP)
MASUDA KYOSO (JP)
INOUE KENICHI (JP)
Application Number:
PCT/JP2019/042467
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F3/00; C22C38/00; H01F1/147; H01F1/20; H01F1/26; H01F27/255; H01F41/02
Foreign References:
JP2018031041A2018-03-01
JP2015088529A2015-05-07
JP2007231330A2007-09-13
JP2019178402A2019-10-17
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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