Title:
SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM
Document Type and Number:
WIPO Patent Application WO/2016/088849
Kind Code:
A1
Abstract:
This soft magnetic resin composition contains flat soft magnetic particles and a resin component that contains an epoxy resin, a phenolic resin and an acrylic resin. The epoxy resin is composed only of an epoxy resin having three or more functional groups, and the phenolic resin is composed only of a phenolic resin having three or more functional groups. The content ratio of the acrylic resin in the resin component is 25% by mass or more.
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Inventors:
FURUKAWA YOSHIHIRO (JP)
Application Number:
PCT/JP2015/084050
Publication Date:
June 09, 2016
Filing Date:
December 03, 2015
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01F1/26; C08L33/04; C08L63/00; H01F3/08; H05K9/00
Domestic Patent References:
| WO2014132879A1 | 2014-09-04 |
Foreign References:
| JP2009059752A | 2009-03-19 | |||
| JP2012212790A | 2012-11-01 | |||
| JP2012241151A | 2012-12-10 | |||
| JP2013181166A | 2013-09-12 |
Other References:
See also references of EP 3229243A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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