SOFT X-RAY APPLYING APPARATUS, SEMICONDUCTOR ASSEMBLING APPARATUS, AND INSPECTING INSTRUMENT

WIPO Patent Application WO/2004/112445

A1

A soft X-ray generating unit (1) and a control unit (2) are separately provided and interconnected through a high-voltage cable (3), thereby reducing the size of the soft X-ray generating unit (1). The soft X-ray generating unit (1) is installed in a semiconductor assembling apparatus (7) or a semiconductor inspecting instrument (8). The air is ionized by irradiating the air with soft X-rays from the soft X-ray generating unit (1) to eliminate the static charge accumulated in a semiconductor (Z) or a semiconductor chip (V). Even at a use environment temperature at which the semiconductor device operates, the soft X-ray generating unit (1) can be stably used without causing malfunction and breakdown of a step-up circuit.

FUJII MASAMI (JP)
MIZOBE HIROYUKI (JP)
EBIHARA NAOHITO (JP)
SATO KOETSU (JP)
MINOBE MITSUMASA (JP)
ISHIWATARITO KEIICHI DI

PCT/JP2004/008666

December 23, 2004

June 14, 2004

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PLA NET CORP (JP)
TORECK CO LTD (JP)
FUJII MASAMI (JP)
MIZOBE HIROYUKI (JP)
EBIHARA NAOHITO (JP)
ISHIWATARITO YOUKO (JP)
SATO KOETSU (JP)
MINOBE MITSUMASA (JP)

G01R31/26; G21K3/00; G21K5/00; G21K5/02; H01L21/50; H01L21/607; H05F3/06; H05G1/02; H05G1/08; (IPC1-7): H05G1/08

JP2001313197A	2001-11-09
JP2002352997A	2002-12-06
JP2001176691A	2001-06-29
JP2001274145A	2001-10-05
JP2002280656A	2002-09-27
JP2002217578A	2002-08-02

Isono, Michizo c/o Isono International Patent Office (Sabo Kaikan Annex 7-4, Hirakawa-cho 2-chom, Chiyoda-ku Tokyo 93, JP)

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