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Patent Searching and Data


Title:
SOIL RETENTION PLATE, SOIL RETENTION PLATE INSTALLATION JIG, AND SOIL RETENTION PLATE CONSTRUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/050499
Kind Code:
A1
Abstract:
The present invention relates to a soil retention plate, a soil retention plate installation jig, and a soil retention plate construction method, and more specifically, to: a soil retention plate which is made of a metal plate and configured such that the modularized soil retention plate can be constructed and dismantled, and is thus reusable; a soil retention plate installation jig which is used to construct and dismantle the soil retention plate; and a soil retention plate construction method using same. In addition, the present invention relates to a soil retention plate having an IoT function, the soil retention plate having a sensor for checking the state of the soil retention plate such that the state of the soil retention plate can be checked in real time. According to an embodiment of the present invention, the soil retention plate comprises: a plate formed by bending a metal plate of a predetermined thickness so that the cross-section of the metal plate has a "C-shape" (hereinafter, the upper horizontal surface, lower horizontal surface, central vertical surface, and open surface of the "C-shape" are referred to as a first surface, a second surface, a third surface, and a first open surface, respectively); a plate engagement panel coupled to at least one side of the plate in the direction of the first open surface; a support formed so as to be coupled to the inside of the plate; a support engagement panel coupled to at least one side of the support and provided so as to face the first open surface when the support is coupled at the inside of the plate; and a beam which is fixed in an upward direction from the ground and provides a point at which the plate is fixed. A plurality of the plates are coupled to supports, which are fewer in number than the plates, to form plate assemblies, and the plate assemblies are coupled in multiple stages between beams.

Inventors:
LEE SUN WOO (KR)
Application Number:
PCT/KR2020/016839
Publication Date:
March 10, 2022
Filing Date:
November 25, 2020
Export Citation:
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Assignee:
DECKMAN CO LTD (KR)
International Classes:
E02D17/04; E02D5/08; E02D17/08
Foreign References:
KR19990080643A1999-11-15
KR200270268Y12002-03-29
KR20130061377A2013-06-11
KR20190002845U2019-11-18
KR102156926B12020-09-17
US20140369753A12014-12-18
Attorney, Agent or Firm:
KIM, Sung Hyun (KR)
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