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Patent Searching and Data


Title:
SOLAR CELL MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/124991
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a solar cell manufacturing method that reduces peeling residue of a pattern printing resist, and that reduces damage to a third intrinsic semiconductor layer during the manufacturing process. The solar cell manufacturing method according to the present invention comprises, in this order: a step for forming, on a back surface side of a semiconductor substrate (11), a material film for a first intrinsic semiconductor layer and a material film for a first conductivity-type semiconductor layer; a step for forming a pattern printing resist on the material film for the first conductivity-type semiconductor layer in a first region (7) on the back surface side of the semiconductor substrate (11), and not forming the pattern printing resist on a light-receiving surface side of the semiconductor substrate (11); a step for forming, using the pattern printing resist in the first region (7) on the back surface side of the semiconductor substrate (11), a first intrinsic semiconductor layer (23) and a first conductivity-type semiconductor layer (25) that are patterned; a step for removing the pattern printing resist; and a step for forming a third intrinsic semiconductor layer (13) on the light-receiving surface side of the semiconductor substrate (11).

Inventors:
WATANABE SHINGO (JP)
SUEZAKI TAKASHI (JP)
Application Number:
PCT/JP2020/045730
Publication Date:
June 24, 2021
Filing Date:
December 08, 2020
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
H01L31/18; H01L31/0747
Domestic Patent References:
WO2015189878A12015-12-17
WO2019216339A12019-11-14
Foreign References:
JP2013509695A2013-03-14
JP2012089829A2012-05-10
JP2013239476A2013-11-28
US20180198002A12018-07-12
Attorney, Agent or Firm:
NIIYAMA Yuichi et al. (JP)
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