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Title:
SOLAR CELL MODULE AND METHOD FOR MANUFACTURING SOLAR CELL MODULE
Document Type and Number:
WIPO Patent Application WO/2012/005318
Kind Code:
A1
Abstract:
Disclosed is a solar cell module wherein adhesion between a rear surface electrode and a tab line is improved with a conductive adhesive film therebetween, and light emitting efficiency is improved. The solar cell module is provided with: a plurality of silicon cell substrates (2), each of which has a front surface electrode provided on the light receiving surface side, and an Al rear surface electrode (13) provided on the rear surface; a tab line (3) which connects together the front surface electrode (11) and the Al rear surface electrode (13); and conductive adhesive layers (20), which connect between the front surface electrode (11) and the tab line (3), and between the Al rear surface electrode (13) and the tab line. In the Al rear surface electrode (13), an opening (31), which exposes the silicon surface of the silicon cell substrate (2), is formed in a connecting portion (30) to the tab line (3), said opening having a width smaller than that of the tab line (3) and that of the conductive adhesive layer (20), and being linearly formed along the connecting portion (30). The tab line (3) is bonded to the silicon surface of the silicon cell substrate (2) with the conductive adhesive layer (20) therebetween, said silicon surface being exposed through the opening (31), and the tab line is also bonded to the Al rear surface electrode (13).

Inventors:
HANAI DAISUKE (JP)
Application Number:
PCT/JP2011/065546
Publication Date:
January 12, 2012
Filing Date:
July 07, 2011
Export Citation:
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Assignee:
SONY CHEM & INF DEVICE CORP (JP)
HANAI DAISUKE (JP)
International Classes:
H01L31/04; H01L31/042
Foreign References:
JP2008135652A2008-06-12
JP2005243935A2005-09-08
JP2008135565A2008-06-12
JPH0983001A1997-03-28
JPH08264817A1996-10-11
JPH05174890A1993-07-13
JP2009295940A2009-12-17
JP2004356349A2004-12-16
JP2008135654A2008-06-12
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
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Claims: