SOLAR CELL SEALANT COMPOSITION AND PRODUCTION METHOD FOR SAME, SOLAR CELL SEALANT LAYER EMPLOYING SAME, AND SOLAR CELL MODULE

WIPO Patent Application WO/2014/199892

A1

The present invention relates to providing a solar cell sealant composition in which, at a molding temperature at which there is substantially no decomposition of organic peroxides, an organic compound additive having a melting point higher than the molding temperature has been uniformly dispersed in an ethylene copolymer, and to a production method for the same. The present invention also relates to a solar cell sealant layer in which an organic compound additive having a melting point higher than the molding temperature is uniformly dispersed in an ethylene copolymer, and to a solar cell module employing the same. Also provided is a production method for a solar cell sealant composition containing an ethylene copolymer (A) and an organic compound additive (B), wherein the production method for a solar cell sealant composition is characterized by including a step in which the ethylene copolymer (A) and the organic compound additive (B) are mixed, within a temperature range at or above the Vicat softening point of the ethylene copolymer, and at or below a temperature 10°C below the softening point of the ethylene copolymer (A).

SENDA HIROKI (JP)
ONOUCHI HISANARI (JP)

PCT/JP2014/064943

December 18, 2014

June 05, 2014

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NITTO DENKO CORP (JP)

C08L31/04; C08J3/20; H01L31/04

WO2011016537A1	2011-02-10
WO2012104298A1	2012-08-09

JP2003104976A	2003-04-09
JP2012119455A	2012-06-21
JP2003171421A	2003-06-20
JP2011216829A	2011-10-27
JP2013118302A	2013-06-13

UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)

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