SOLDER ALLOY FOR ACOUSTIC DEVICE - SENJU METAL INDUSTRY CO

Title:

SOLDER ALLOY FOR ACOUSTIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/108421

Kind Code:

A1

Abstract:

　Disclosed is a solder alloy for an acoustic device, which used as solder for bonding various electronic components in an electronic circuit such as a filter circuit NW for an audio system, and which is composed of six elements (Sn, Ag, Cu, Sb, In, Ni, Pb) in an appropriate quantity in order to obtain a high sound quality and a high audio value. One example of preferable contents is: 1,0 to 1,01 mass % of Ag, 0,71 to 0,72 mass % of Cu, 0,003 to 0,0037 mass % of In, 0,016 to 0,017 mass % of Ni and 0,0025 to 0,0035 mass % of Pb, with the remainder consisting of Sn.

Inventors:

AKAGI IPPEI (JP)
TOKIMOTO HIDEKI (JP)
SUZUKI SEIKI (JP)
SEINO MASAHUMI (JP)
OSAWA ISAMU (JP)
UESHIMA MINORU (JP)

Application Number:

PCT/JP2012/062009

Publication Date:

July 25, 2013

Filing Date:

May 10, 2012

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)
AKAGI IPPEI (JP)
TOKIMOTO HIDEKI (JP)
SUZUKI SEIKI (JP)
SEINO MASAHUMI (JP)
OSAWA ISAMU (JP)
UESHIMA MINORU (JP)

International Classes:

C22C13/00; B23K35/26

Foreign References:

JP2000173253A	2000-06-23
JP2001001180A	2001-01-09
JP2002096191A	2002-04-02
JP2005103645A	2005-04-21
JPH11277290A	1999-10-12
JP2002239780A	2002-08-28
JP2003230980A	2003-08-19

Other References: