SOLDER ALLOY COMPOSITION HAVING IMPROVED MISSING RATE AND METHOD FOR PREPARING SAME

Title:

SOLDER ALLOY COMPOSITION HAVING IMPROVED MISSING RATE AND METHOD FOR PREPARING SAME

Document Type and Number:

WIPO Patent Application WO/2017/047974

Kind Code:

A1

Abstract:

The present invention relates to a solder alloy composition having an improved missing rate and a method for preparing the same. More specifically, the present invention provides a tin-based solder ball containing 0-4.0 wt% of silver (Ag), 0.1-1.2 wt% of copper (Cu), 0.001-0.1 wt% of nickel (Ni), 0.0005 wt% or less of lead (Pb), 0.002 wt% or less of bismuth (Bi), 0.005-0.01 wt% of germanium (Ge), 0.002-0.005 wt% of phosphor (P), and the balance tin (Sn), wherein the missing rate is 200 ppm (0.02%) or less when an attachment process is performed on a printed circuit board.

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JPH073860	[Name of device] Automatic soldering machine
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JPS5254639	ROLL TYPE SOLDER BATH

Inventors:

LEE HYUN KYU (KR)
CHU YONG CHEOL (KR)
CHUN MYOUNG HO (KR)
PARK EUN KWANG (KR)
EUN DONG JIN (KR)

Application Number:

PCT/KR2016/010053

Publication Date:

March 23, 2017

Filing Date:

September 08, 2016

Export Citation:

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Assignee:

DUKSAN HIGH METAL CO LTD (KR)

International Classes:

H05K3/34; B23K35/02; B23K35/26

Foreign References:

KR101539056B1	2015-07-24
KR20120135656A	2012-12-17
KR20150056886A	2015-05-28
KR20130083663A	2013-07-23
KR100395438B1	2003-08-21

Attorney, Agent or Firm:

TW INTERNATIONAL PATENT AND LAWFIRM (KR)

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