SOLDER ALLOY, ELECTRONIC MEMBER HAVING SOLDER BALL AND SOLDER BUMP

Title:

SOLDER ALLOY, ELECTRONIC MEMBER HAVING SOLDER BALL AND SOLDER BUMP

Document Type and Number:

WIPO Patent Application WO/2001/036148

Kind Code:

A1

Abstract:

A lead-free solder alloy, characterized in that it has a chemical composition: Ag: 2 to 3 wt %, Cu: 0.3 to 1.5 wt %, Bi: 0.05 to 1.5 wt %, Sb: 0.2 to 1.5, balance: Sn and inevitable impurities, with the proviso that the total content of Ag, Cu, Sb and Bi is 5 wt % or less, and is capable of forming a smooth surface after reflow treatment; and an electronic member, such as a semiconductor device, manufactured by the use of the lead-free solder alloy. The solder alloy has an appropriate melting point and excellent resistance to thermal fatigue, and can form, after solder reflow, a surface having smoothness and excellent properties being sufficient to permit the optical evaluation for the formation of a bump, and thus can be used as an excellent material for solder bumps of an electronic member.

Inventors:

TANAKA MASAMOTO (JP)
ENDO MICHIO (JP)
HASHINO EIJI (JP)
TATSUMI KOHEI (JP)
NAKAMORI TAKASHI (JP)
FUJISHIMA MASAMI (JP)

Application Number:

PCT/JP2000/008163

Publication Date:

May 25, 2001

Filing Date:

November 20, 2000

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NIPPON STEEL CORP (JP)
NIPPON MICROMETAL CORP (JP)
TANAKA MASAMOTO (JP)
ENDO MICHIO (JP)
HASHINO EIJI (JP)
TATSUMI KOHEI (JP)
NAKAMORI TAKASHI (JP)
FUJISHIMA MASAMI (JP)

International Classes:

B23K35/14; B23K35/26; H01L21/60; (IPC1-7): B23K35/26; B23K1/00; H05K3/34

Foreign References:

JPH08215880A	1996-08-27
JPH0550286A	1993-03-02
JPH0788680A	1995-04-04
JPH11114691A	1999-04-27
JPH09181125A	1997-07-11

Other References: