Title:
SOLDER ALLOY, SOLDER JUNCTION MATERIAL, AND ELECTRONIC CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/069788
Kind Code:
A1
Abstract:
This solder alloy is used in soldering and has a chemical composition that includes, in percent by mass, 2.0-4.0% of Ag, 0.6-1.2% of Cu, 2.0-5.0% of Sb, 1.1-3.5% of In, 0-0.20% of Ni, 0-0.2% of Co, and 0-0.05% of Ge, the balance being Sn and unavoidable impurities.
Inventors:
WADA TAKEHIRO (JP)
Application Number:
PCT/JP2018/035932
Publication Date:
April 11, 2019
Filing Date:
September 27, 2018
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02; H05K3/34
Foreign References:
| US20160325384A1 | 2016-11-10 | |||
| JP2016179498A | 2016-10-13 | |||
| JP2017170465A | 2017-09-28 | |||
| CN1398697A | 2003-02-26 | |||
| JP6230737B1 | 2017-11-15 | |||
| JP2014057974A | 2014-04-03 | |||
| JP2017060997A | 2017-03-30 |
Other References:
See also references of EP 3590652A4
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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