SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN CORED SOLDER, AND SOLDER JOINT

Title:

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN CORED SOLDER, AND SOLDER JOINT

Document Type and Number:

WIPO Patent Application WO/2019/171710

Kind Code:

A1

Abstract:

Provided are: a solder alloy which has a low melting point and therefore does not undergo the occurrence of unfusion, has excellent mechanical properties and impact resistance, and also has excellent heat cycle resistance; a solder paste; a solder ball; a resin cored solder; and a solder joint. The solder alloy has an alloy composition comprising, in % by mass, 35 to 68% of Bi, 0.5% to 3.0% of In, 0.01 to 0.10% of Pd, with the remainder made up by Sn, for the purpose of fining down the alloy texture thereof. The alloy composition may contain, in % by mass, 1.0 to 2.0% of In, may also contain, in % by mass, 0.01 to 0.03% of Pd, and may also contain at least one of Co, Ti, Al and Mn in the total amount of, in % by mass, 0.1% or less. The solder alloy can be used suitably in a solder paste, a solder ball, a resin cored solder and a solder joint.

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Inventors:

YOKOYAMA TAKAHIRO (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
NOMURA HIKARU (JP)
YOSHIKAWA SHUNSAKU (JP)

Application Number:

PCT/JP2018/047180

Publication Date:

September 12, 2019

Filing Date:

December 21, 2018

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B23K35/26; B23K35/14; B23K35/22; C22C12/00; C22C13/02

Foreign References:

JPH071179A	1995-01-06
US20130153646A1	2013-06-20
JP2004152558A	2004-05-27

Other References: