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Patent Searching and Data


Title:
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN-FLUX CORED SOLDER, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2019/171978
Kind Code:
A1
Abstract:
Provided is a solder alloy that has a low melting point to prevent non-fusion, has improved ductility and adhesion strength, and has excellent heat cycle resistance. This solder alloy has an alloy composition composed of, on a percent by mass basis: 35 to 68% of Bi, 0.1 to 2.0% of Sb and 0.01 to 0.10% of Ni, with the remainder consisting of Sn. Preferably, the solder alloy contains a total of 0.1% or less of at least one of Co, Ti, Al and Mn. The solder alloy can be suitably used for solder pastes, solder balls, resin-flux cored solder and solder joints.

Inventors:
YOKOYAMA TAKAHIRO (JP)
MATSUFUJI TAKAHIRO (JP)
NOMURA HIKARU (JP)
YOSHIKAWA SHUNSAKU (JP)
Application Number:
PCT/JP2019/006702
Publication Date:
September 12, 2019
Filing Date:
February 22, 2019
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B23K35/14; B23K35/22; C22C12/00; C22C13/02
Foreign References:
JP2013540591A2013-11-07
JP2017051984A2017-03-16
CN102059473A2011-05-18
JPH11221693A1999-08-17
JP2000280090A2000-10-10
JP5578301B12014-08-27
JP5679094B12015-03-04
Other References:
See also references of EP 3666453A4
Attorney, Agent or Firm:
KENMOTSU Hidetaka (JP)
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