Title:
SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/018167
Kind Code:
A1
Abstract:
This solder alloy is substantially composed of tin, silver, copper, bismuth, antimony, and cobalt. Relative to the total amount of the solder alloy, the content percentage of silver is 3%-3.5% by mass inclusive, the content percentage of copper is 0.4%-1.0% by mass inclusive, the content percentage of bismuth is 3.5%-4.8% by mass inclusive, the content percentage of antimony is 3%-5.5% by mass inclusive, the content percentage of cobalt is 0.001%-0.1% by mass inclusive, and the content percentage of tin is the remaining percentage. Moreover, the sum of the content percentage of bismuth and the content percentage of antimony is 7.3%-10.3% by mass inclusive.
Inventors:
IKEDA KAZUKI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
INOUE KOSUKE (JP)
ICHIKAWA KAZUYA (JP)
TAKEMOTO TADASHI (JP)
Application Number:
PCT/JP2016/070270
Publication Date:
February 02, 2017
Filing Date:
July 08, 2016
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B23K35/22; B23K35/26; C22C13/02
Domestic Patent References:
| WO2014163167A1 | 2014-10-09 |
Foreign References:
| JP5723056B1 | 2015-05-27 |
Other References:
See also references of EP 3326745A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki (JP)
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