Title:
SOLDER ALLOY, SOLDER PASTE, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2024/034689
Kind Code:
A1
Abstract:
Provided are a solder alloy, a solder paste, and a solder joint, which exhibit a suitable melting temperature, are excellent in terms of wettability, have high tensile strength and shear strength, and have excellent drop impact resistance. The solder alloy has the following alloy composition. The alloy composition comprises 0.1-3.9 mass% of Ag, 0.1-1.0 mass% of Cu, 0.6-1.4 mass% of Bi, 5.1-7.9 mass% of Sb, 0.01-0.30 mass% of Ni, and 0.001-0.100 mass% of Co, with the balance being Sn.
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Inventors:
YOKOYAMA TAKAHIRO (JP)
YOSHIKAWA SHUNSAKU (JP)
IIJIMA YUKI (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
SUGISAWA KOTA (JP)
SUZUKI SHIGETO (JP)
YOSHIKAWA SHUNSAKU (JP)
IIJIMA YUKI (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
SUGISAWA KOTA (JP)
SUZUKI SHIGETO (JP)
Application Number:
PCT/JP2023/029383
Publication Date:
February 15, 2024
Filing Date:
August 11, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/02
Domestic Patent References:
| WO2018181873A1 | 2018-10-04 |
Foreign References:
| JP2014028391A | 2014-02-13 | |||
| JP2022026827A | 2022-02-10 | |||
| JP2014057974A | 2014-04-03 |
Attorney, Agent or Firm:
KENMOTSU Hidetaka (JP)
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