Title:
SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2018/012642
Kind Code:
A1
Abstract:
A novel solder alloy is provided which contains Sn, Bi and Zn, with Bi 42-62 mass%, Zn 0.2-3.6 mass%, and the remainder Sn and unavoidable impurities; this solder alloy can be used in a low temperature range.
Inventors:
YAHAGI MASATAKA (JP)
FURUSAWA HIDEKI (JP)
FURUSAWA HIDEKI (JP)
Application Number:
PCT/JP2017/025976
Publication Date:
January 18, 2018
Filing Date:
July 18, 2017
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22C12/00; B23K35/26; C22C13/02; C22C30/06
Foreign References:
| JP2016026883A | 2016-02-18 | |||
| JPH08298392A | 1996-11-12 | |||
| CN103264237A | 2013-08-28 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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