Title:
SOLDER BALL LASER WELDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/041638
Kind Code:
A1
Abstract:
A solder ball laser welding method, comprising: moving a laser beam of a first power density along a welding track (20) to irradiate a solder ball (10) placed on a bonding pad, so as to soften the solder ball (10), the welding track (20) surrounding the solder ball (10); moving a laser beam of a second power density along the welding track (20) to irradiate the softened solder ball (10), so as to melt the softened solder ball (10), the welding track (20) falling on the softened solder ball (10), and the second power density being larger than the first power density; and moving a laser beam of a third power density along the welding track (20) to irradiate the melted solder ball (10), so as to assist in solidification of the melted solder ball (10), the third power density being smaller than the first power density. By means of the solder ball laser welding method, the technical problems in the existing solder ball welding technology that a bonding pad would be easily burnt in a welding process and that the welding quality is poor are resolved.
Inventors:
ZHANG JINRONG (CN)
Application Number:
PCT/CN2017/116208
Publication Date:
March 07, 2019
Filing Date:
December 14, 2017
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
B23K26/00; B23K1/005
Foreign References:
| CN101947677A | 2011-01-19 | |||
| CN106944705A | 2017-07-14 | |||
| CN105081574A | 2015-11-25 | |||
| CN102139412A | 2011-08-03 | |||
| CN204295087U | 2015-04-29 | |||
| KR101180481B1 | 2012-09-06 |
Attorney, Agent or Firm:
TEKYRS INTELLECTUAL PROPERTY INC. (CN)
Download PDF:
Previous Patent: SHED FRAME
Next Patent: INFORMATION STORAGE AND DISPLAY METHOD, DEVICE, EQUIPMENT AND COMPUTER STORAGE MEDIUM
Next Patent: INFORMATION STORAGE AND DISPLAY METHOD, DEVICE, EQUIPMENT AND COMPUTER STORAGE MEDIUM