Title:
SOLDER BALL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC PARTS USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/192003
Kind Code:
A1
Abstract:
A solder ball, a manufacturing method therefor, and electronic parts comprising the same are disclosed in the present specification. More specifically, disclosed is a solder ball which is applicable in all technical fields which are based on solder ball bonding, and especially may be used in semiconductor packages using solder balls as basic contacts in the electronics industry. The solder ball maintains the shape of a core comprising a metal having a low melting point even during reflow, and has stable bonding reliability with a substrate.
Inventors:
LEE HYUN KYU (KR)
KWAK JUNG UG (KR)
KIM KYUNG TAE (KR)
CHUN MYOUNG HO (KR)
PARK EUN KWANG (KR)
EUN DONG JIN (KR)
CHU YONG CHEOL (KR)
KWAK JUNG UG (KR)
KIM KYUNG TAE (KR)
CHUN MYOUNG HO (KR)
PARK EUN KWANG (KR)
EUN DONG JIN (KR)
CHU YONG CHEOL (KR)
Application Number:
PCT/KR2017/004686
Publication Date:
November 09, 2017
Filing Date:
May 02, 2017
Export Citation:
Assignee:
DUKSAN HIGH METAL CO LTD (KR)
International Classes:
H01L23/00; B23K1/00; B23K35/02; H01L23/488
Foreign References:
| KR20110021618A | 2011-03-04 | |||
| KR101284363B1 | 2013-07-08 | |||
| KR101550560B1 | 2015-09-04 | |||
| JP2007075856A | 2007-03-29 | |||
| KR20100037946A | 2010-04-12 |
Attorney, Agent or Firm:
TW INTERNATIONAL PATENT AND LAWFIRM (KR)
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