Title:
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
Document Type and Number:
WIPO Patent Application WO/2010/093031
Kind Code:
A1
Abstract:
A method of using a solder transfer sheet, which does not require position alignment, to form solder bumps on electrodes of a printed circuit board without forming a bridge. The solder transfer sheet comprises a support base on at least one surface of which a solder layer is deposited. The method includes overlaying the solder transfer sheet on the circuit board, heating, under pressure, to a temperature lower than the solidus temperature of the solder to selectively bond the solder layer to the electrodes by means of solid phase diffusion bonding, and peeling the transfer sheet from the circuit board. The solder layer may be a layer formed from a continuous solder film or one layer of solder particles deposited on the support base by an adhesive layer.
Inventors:
KURAMOTO Takeo (2224-6, Nurumizu Atsugi-sh, Kanagawa 33, 〒2430033, JP)
倉本 武夫 (〒33 神奈川県厚木市温水２２２４－６ Kanagawa, 〒2430033, JP)
TSURUTA Kaichi (1627, Fukasawa Motegimachi, Haga-gu, Tochigi 28, 〒3213628, JP)
倉本 武夫 (〒33 神奈川県厚木市温水２２２４－６ Kanagawa, 〒2430033, JP)
TSURUTA Kaichi (1627, Fukasawa Motegimachi, Haga-gu, Tochigi 28, 〒3213628, JP)
Application Number:
JP2010/052137
Publication Date:
August 19, 2010
Filing Date:
February 15, 2010
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO., LTD. (23 Senju-hashido-cho, Adachi-ku Tokyo, 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
KURAMOTO Takeo (2224-6, Nurumizu Atsugi-sh, Kanagawa 33, 〒2430033, JP)
倉本 武夫 (〒33 神奈川県厚木市温水２２２４－６ Kanagawa, 〒2430033, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
KURAMOTO Takeo (2224-6, Nurumizu Atsugi-sh, Kanagawa 33, 〒2430033, JP)
倉本 武夫 (〒33 神奈川県厚木市温水２２２４－６ Kanagawa, 〒2430033, JP)
International Classes:
H05K3/34; B23K1/20; B23K3/06; H01L21/60
Attorney, Agent or Firm:
HIROSE Shoichi (Tozan Building, 4-2 Nihonbashi Honcho 4-chome, Chuo-k, Tokyo 23, 〒1030023, JP)