Title:
SOLDER BUMP AND FORMING METHOD THEREFOR, AND SUBSTRATE HAVING SOLDER BUMP AND MANUFACTURING METHOD FOR SUBSTRATE HAVING SOLDER BUMP
Document Type and Number:
WIPO Patent Application WO/2013/157075
Kind Code:
A1
Abstract:
[Problem] To provide a solder bump forming method capable of forming solder bumps having a desired constant thickness, without any failure such as copper corrosion, on a mounting board such as a printed circuit board having fine copper electrodes. [Solution] The solder bump forming method includes: a process in which a prepared mask (5) is placed on a prepared substrate (1) and then a molten solder jet is blown to fill an opening of the mask (5) with molten solder (11a) until the molten solder (11a) exceeds the thickness of the mask (5); a process of removing a part of the molten solder (11a) that exceeds the thickness of the mask (5) to form a solder bump (11) having a predetermined thickness; and a process of removing the mask (5). The molten solder (11a) is molten lead-free solder that includes tin as a main ingredient and at least nickel as a sub ingredient, and further includes one or more other ingredients such as silver, copper, and germanium. The part of the molten solder (11a) that exceeds the thickness of the mask (5) is removed by using a blade or an air cutter or by spraying a solution (18) that includes organic fatty acid having 12 to 20 carbon atoms.
Inventors:
TANIGURO KATSUMORI (JP)
Application Number:
PCT/JP2012/060301
Publication Date:
October 24, 2013
Filing Date:
April 17, 2012
Export Citation:
Assignee:
TANIGUROGUMI CORP (JP)
TANIGURO KATSUMORI (JP)
TANIGURO KATSUMORI (JP)
International Classes:
H01L21/60
Foreign References:
| JP2001044231A | 2001-02-16 | |||
| JP2002514352A | 2002-05-14 | |||
| JPH04234195A | 1992-08-21 | |||
| JP2001203444A | 2001-07-27 | |||
| JPH0864943A | 1996-03-08 | |||
| JP2011236457A | 2011-11-24 | |||
| JPH10286936A | 1998-10-27 | |||
| JP2006066811A | 2006-03-09 |
Other References:
See also references of EP 2840596A4
Attorney, Agent or Firm:
YOSHIMURA, SHUNICHI (JP)
Toshikazu Yoshimura (JP)
Toshikazu Yoshimura (JP)
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