Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLDER-COATED BALL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/141166
Kind Code:
A1
Abstract:
A solder-coated ball (10A) according to one embodiment of the present invention has a ball-shaped core (11) and a solder layer (12) formed so as to coat the core (11), the solder layer (12) includes Sn and Bi, the Bi content is 45 mass% to 65 mass%, and the Bi content is high on the inside and low on the outside. Another solder-coated ball (10B) further has a Ni plating layer (13) between the core (11) and the solder layer (12).

Inventors:
ASADA KEN (JP)
NISHIMURA JUNKO (JP)
Application Number:
JP2013/057484
Publication Date:
September 26, 2013
Filing Date:
March 15, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEOMAX MATERIALS CO LTD (JP)
HITACHI METALS LTD (JP)
International Classes:
C25D7/00; B22F1/00; B22F1/02; B23K35/14; B23K35/26; C22C12/00; C22C13/02; C25D17/22; H01L21/60
Foreign References:
JP2007046087A2007-02-22
JP2005005630A2005-01-06
Attorney, Agent or Firm:
OKUDA SEIJI (JP)
Seiji Okuda (JP)
Download PDF: