Title:
SOLDER-COATED COMPONENT, PROCESS FOR PRODUCING SAME, AND METHOD FOR MOUNTING SAME
Document Type and Number:
WIPO Patent Application WO/2010/134552
Kind Code:
A1
Abstract:
In order to enable a housing component to have a fillet formed throughout the whole region of a desired soldering area and to be reliably and tenaciously bonded to a substrate without leaving an unsoldered portion or generating voids, etc., a shielding case (100) is provided with a surface-treated frame member (11) obtained by successively forming a nickel coating film and a tin alloy deposit each having a given thickness and coating the tin alloy deposit with a lead-free molten solder, as shown in fig. 1. A frame member (11) is processed into the shape of the shielding case (100) and then subjected to a surface treatment, in which a nickel coating film and a tin alloy deposit are successively formed on some or all of the shielding case (100) to prime the frame member and some or all of the primed frame member (11) is coated with a molten solder. Some of the shape of the shielding case (100) serves as a surface to be soldered for surface mounting.
Inventors:
SATO ISAMU (JP)
WATANABE KOJI (JP)
SUZUKI MICHIO (JP)
AZUMA TAKENORI (JP)
DEGUCHI MUTSUMI (JP)
ITO MASAYA (JP)
WATANABE KOJI (JP)
SUZUKI MICHIO (JP)
AZUMA TAKENORI (JP)
DEGUCHI MUTSUMI (JP)
ITO MASAYA (JP)
Application Number:
PCT/JP2010/058466
Publication Date:
November 25, 2010
Filing Date:
May 19, 2010
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
SATO ISAMU (JP)
WATANABE KOJI (JP)
SUZUKI MICHIO (JP)
AZUMA TAKENORI (JP)
DEGUCHI MUTSUMI (JP)
ITO MASAYA (JP)
SATO ISAMU (JP)
WATANABE KOJI (JP)
SUZUKI MICHIO (JP)
AZUMA TAKENORI (JP)
DEGUCHI MUTSUMI (JP)
ITO MASAYA (JP)
International Classes:
H05K9/00; B23K1/20; B23K101/42
Domestic Patent References:
| WO2006035542A1 | 2006-04-06 |
Foreign References:
| JP2004156147A | 2004-06-03 | |||
| JP2001155955A | 2001-06-08 | |||
| JP2002141456A | 2002-05-17 | |||
| JP2002359312A | 2002-12-13 | |||
| JPH0563100U | 1993-08-20 | |||
| JP2001217588A | 2001-08-10 | |||
| JPH07147495A | 1995-06-06 | |||
| JPH01289298A | 1989-11-21 | |||
| JPH10117062A | 1998-05-06 | |||
| JPH03104197A | 1991-05-01 |
Attorney, Agent or Firm:
YAMAGUCHI Kunio et al. (JP)
Kunio Yamaguchi (JP)
Kunio Yamaguchi (JP)
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Claims:
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