Title:
SOLDER COATING DEVICE AND SOLDER COATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/085207
Kind Code:
A1
Abstract:
[Purpose] The present invention relates to a solder coating device and a solder coating method, and a purpose thereof is to perform clean solder coating in which adhesion of floating matter does not occur. [Configuration] The present invention comprises: a solder liquid tank that has a solder with which coating is performed placed therein and houses the heated and melted solder; a heater that heats the solder; a hole that is provided in a side surface of the solder liquid tank, in a location below the liquid surface of the solder, and has an aperture through which a conductor passes to the exterior from within the melted solder, said conductor being subjected to coating with the solder; and a winder that causes the conductor to pass through the melted solder in the solder liquid tank and pulls the result out of the hole to the exterior.
Inventors:
ARAI KATSUYA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
MORI NAOHISA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
MORI NAOHISA (JP)
Application Number:
PCT/JP2020/040021
Publication Date:
April 28, 2022
Filing Date:
October 24, 2020
Export Citation:
Assignee:
ARTBEAM CO LTD (JP)
International Classes:
C23C2/38; C23C2/08
Foreign References:
| JPS60238467A | 1985-11-27 | |||
| JPS61143575A | 1986-07-01 | |||
| JPS5131654A | 1976-03-17 | |||
| JP2012017515A | 2012-01-26 |
Attorney, Agent or Firm:
OKADA Morihiro (JP)
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