Title:
SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/066489
Kind Code:
A1
Abstract:
A solder composition according to the present invention is characterized by comprising: a flux composition containing (A) a rosin resin, (B) an activator, and (C) a solvent; and (D) a solder powder having a melting point of 200-250°C, wherein the (B) component contains at least one substance selected from the group consisting of (B1) aromatic carboxylic acids having a hydroxy group only at the ortho position or the pros position, (B2) dicarboxylic acids having an alkylene group and having 2-8 carbon atoms, and (B3) monocarboxylic acids having an alkyl group and having 2-8 carbon atoms, and the component (C) contains (C1) a diol or a diol diacetate having a boiling point of 220–250°C.
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Inventors:
EINISHI HIRO (JP)
USUKURA SHINICHI (JP)
YOSHIZAWA SHINJI (JP)
IWABUCHI MITSURU (JP)
USUKURA SHINICHI (JP)
YOSHIZAWA SHINJI (JP)
IWABUCHI MITSURU (JP)
Application Number:
PCT/JP2019/034542
Publication Date:
April 02, 2020
Filing Date:
September 03, 2019
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Foreign References:
| JP2017185542A | 2017-10-12 | |||
| JP2014100737A | 2014-06-05 | |||
| JPH08155675A | 1996-06-18 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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